TSMC's American Chips Still Need a Piece Made Elsewhere. GlobalFoundries Is Signing Up to Make It in New York.
GlobalFoundries and TSMC announced a five-year, $2 billion agreement on Thursday under which GlobalFoundries will make silicon interposers, a component of TSMC's CoWoS advanced packaging, at its Malta, New York, plant. Volume production is due in the first half of 2028.













